ADSP-BF538BBCZ-4F4 Analog Devices Inc, ADSP-BF538BBCZ-4F4 Datasheet - Page 6

• Manufacturer Part Number: ADSP-BF538BBCZ-4F4
• Description: IC, FLOAT-PT DSP, 16BIT, 400MHZ, BGA-316
• Manufacturer: Analog Devices Inc
• Series: Blackfinr
• Type: Fixed Pointr

Specifications of ADSP-BF538BBCZ-4F4

• No. Of Bits: 16 Bit
• Frequency: 400MHz
• Supply Voltage: 1.2V
• Embedded Interface Type: CAN, I2C, PPI, SPI, TWI, UART
• No. Of I/o's: 54
• Flash Memory Size: 512KB
• Interface: CAN, SPI, SSP, TWI, UART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (512 kB)
• On-chip Ram: 148kB
• Voltage - I/o: 3.00V, 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 316-CSPBGA
• Device Core Size: 16b
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Mips: 400
• Device Input Clock Speed: 400MHz
• Ram Size: 32KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/2.5/3.3V
• Operating Supply Voltage (min): 0.8/2.25/2.7V
• Operating Supply Voltage (max): 1.32/3.6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 316
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BFAUDIO-EZEXT - BOARD EVAL AUDIO BLACKFIN
• Lead Free Status / Rohs Status: Compliant

ADSP-BF538/ADSP-BF538F
External (Off-Chip) Memory
External memory is accessed via the external bus interface unit
(EBIU). This 16-bit interface provides a glueless connection to a
bank of synchronous DRAM (SDRAM) as well as up to four
banks of asynchronous memory devices including flash,
EPROM, ROM, SRAM, and memory mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed
to interface to up to 128M bytes of SDRAM. The SDRAM con-
troller allows one row to be open for each internal SDRAM
bank, for up to four internal SDRAM banks, improving overall
system performance.
The asynchronous memory controller can be programmed to
control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
1M byte segment regardless of the size of the devices used, so
that these banks will only be contiguous if each is fully popu-
lated with 1M byte of memory.
Flash Memory (ADSP-BF538F8 Only)
The ADSP-BF538F8 processor contains a separate flash die,
connected to the EBIU bus, within the package of the processor.
Figure 4
sor die are connected.
The ADSP-BF538F8 contains an 8M bit (512K × 16-bit) bottom
boot sector Spansion S29AL008J known good die flash memory.
For additional information, visit www.spansion.com. Features
include the following:
• Access times as fast as 70 ns (EBIU registers must be set
• Sector protection
• One million write cycles per sector
• 20 year data retention
appropriately)
Figure 4. Internal Connection of Flash Memory (ADSP-BF538F8)
ADSP-BF539F
PACKAGE
shows how the flash memory die and Blackfin proces-
ADDR19-1
DATA15-0
V DDEXT
AMS3-0
RESET
ARDY
AWE
ARE
GND
A18-0
OE
WE
RY/BY
DQ15-0
VSS
VCC
BYTE
CE
RESET
WP
Rev. D | Page 6 of 56 | July 2010
The Blackfin processor connects to the flash memory die with
address, data, chip enable, write enable, and output enable con-
trols as if it were an external memory device. Note that the
write-protect input pin to the flash is not connected and inac-
cessible, disabling this feature.
The flash chip enable pin FCE must be connected to AMS0 or
AMS3–1 through a printed circuit board trace. When connected
to AMS0, the Blackfin processor can boot from the flash die.
When connected to AMS3–1, the flash memory appears as non-
volatile memory in the processor memory map, shown in
Figure
Flash Memory Programming
The ADSP-BF538F8 flash memory can be programmed before
or after mounting on the printed circuit board.
To program the flash prior to mounting on the printed circuit
board, use a hardware programming tool that can provide the
data, address, and control stimuli to the flash die through the
external pins on the package. During this programming, V
and GND must be provided to the package and the Blackfin
must be held in reset with bus request (BR) asserted and a
CLKIN provided.
The VisualDSP++ tools can be used to program the flash mem-
ory after the device is mounted on a printed circuit board.
Flash Memory Sector Protection
To use the sector protection feature, a high voltage (+12 V nom-
inal) must be applied to the flash FRESET pin. Refer to the flash
data sheet for details.
I/O Memory Space
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space. On-
chip I/O devices have their control registers mapped into mem-
ory mapped registers (MMRs) at addresses near the top of the
4G byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func-
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The MMRs are accessible only in supervisor mode and appear
as reserved space to on-chip peripherals.
Booting
The ADSP-BF538/ADSP-BF538F processors contain a small
boot kernel, which configures the appropriate peripheral for
booting. If the processor is configured to boot from boot ROM
memory space, the processor starts executing from the on-chip
boot ROM. For more information, see
Page
Event Handling
The event controller on the ADSP-BF538/ADSP-BF538F pro-
cessors handle all asynchronous and synchronous events to the
processors. The processor provides event handling that sup-
ports both nesting and prioritization. Nesting allows multiple
event service routines to be active simultaneously. Prioritization
16.
3.
Booting Modes on
DDEXT