IC FLEX 10K FPGA 30K 208-RQFP

EPF10K30RI208-4

Manufacturer Part NumberEPF10K30RI208-4
DescriptionIC FLEX 10K FPGA 30K 208-RQFP
ManufacturerAltera
SeriesFLEX-10K®
EPF10K30RI208-4 datasheet
 


Specifications of EPF10K30RI208-4

Number Of Logic Elements/cells1728Number Of Labs/clbs216
Total Ram Bits12288Number Of I /o147
Number Of Gates69000Voltage - Supply4.5 V ~ 5.5 V
Mounting TypeSurface MountOperating Temperature-40°C ~ 100°C
Package / Case208-RQFPLead Free Status / RoHS StatusContains lead / RoHS non-compliant
Other names544-2233  
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FLEX 10K Embedded Programmable Logic Device Family Data Sheet
SameFrame
Pin-Outs
36
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K10A device in a 256-pin
FineLine BGA package to an EPF10K100A device in a 484-pin
FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to lay out a board to
take advantage of this migration (see
Figure 16. SameFrame Pin-Out Example
Designed for 484-PinFineLine BGA Package
256-Pin
FineLine
BGA
256-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
Figure
16).
Printed Circuit Board
484-Pin
FineLine
BGA
484-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
Altera Corporation