IBM25PPC440GP IBM Microelectronics, IBM25PPC440GP Datasheet - Page 49

• Manufacturer Part Number: IBM25PPC440GP
• Description: PowerPC 440GP Embedded Processor
• Manufacturer: IBM Microelectronics

PowerPC 440GP Embedded Processor Data Sheet
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
5/13/04
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device. None of the performance specification contained in this document are guaranteed
when operating at these maximum ratings.
Junction-to-case thermal resistance
Case-to-ambient thermal resistance (w/o heat sink)
Junction-to-ball (typical)
Notes:
Supply Voltage (Internal Logic)
Supply Voltage (I/O Interface, except DDR SDRAM)
PLL Supply Voltages
Supply Voltage (DDR SDRAM Logic)
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
Case temperature under bias
Notes:
1. Case temperature, T
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately
3. Modeled on standard JEDEC 2S2P card, 50x50mm
1. If OV
2. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
3. This value is not a specification of the operational temperature range, it is a stress rating only.
predict thermal performance in production equipment environments. The operational case temperature must be maintained.
V
duration during each power up or power down event.
PPC440GP. A separate filter, as shown below, is recommended for each voltage:
DD
DD
≤ 0.4V, it is required that V
Characteristic
Parameter
L
C
, is measured at top center of case surface with device soldered to circuit board.
C
DD
≤ 0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms
AxV
L – SMT ferrite bead chip, Murata BLM31A700S
C – 0.1
DD
Symbol
θ
θ
θ
µ
CA
JC
JB
F ceramic
Symbol
AxV
OV
SV
T
V
V
V
T
STG
DD
IN
IN
C
DD
DD
DD
Ceramic
Plastic
Ceramic
Plastic
Ceramic
Plastic
Package
0 (0)
<0.1
18.9
1.2
-55 to +150
-40 to +120
0 to +1.95
0 to +1.95
0 to +3.6
0 to +2.7
0 to +3.6
0 to +5.5
Value
ft/min (m/sec)
100 (0.51)
Airflow
<0.1
17.7
20.8
1.2
8.0
200 (1.02)
<0.1
16.3
1.2
Unit
°C
°C
V
V
V
V
V
V
Page 49 of 72
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
Notes
1
1
2
3
1, 3
2, 3
1
2
3