IBM25PPC440GP IBM Microelectronics, IBM25PPC440GP Datasheet - Page 50

• Manufacturer Part Number: IBM25PPC440GP
• Description: PowerPC 440GP Embedded Processor
• Manufacturer: IBM Microelectronics

Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the
heat sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks
may be attached to the package by several methods: adhesive, spring clips to the printed-circuit board or
package, or a mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing
excessive mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account
for the shock and vibration effects of any particular application.
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Thermal grease
Heat sink
Heat sink clip
Heat sink clip
CBGA
package
Static compression (spring force)—2.27kg maximum
Printed
circuit
board
Printed
circuit
board
Adhesive
CBGA
Heat sink
package
Spring clip to package
PowerPC 440GP Embedded Processor Data Sheet
Weight
force
Heat sink clip
Heat sink clip
Heat sink
Thermal grease
CBGA
package
Printed
circuit
board
Static compression (spring force)—2.27kg maximum
Note 1: Force is limited by allowable compression on the die.
Heat sink
Heat sink weight force—60g maximum
Printed
circuit
board
CBGA
package
Adhesive
Allowable package compression force is 4.4kg.
Spring clip to board
Weight
force
5/13/04
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