C8051F962-A-GM Silicon Labs, C8051F962-A-GM Datasheet - Page 55

• Manufacturer Part Number: C8051F962-A-GM
• Description: 8-bit Microcontrollers - MCU 128KB, DC-DC, AES DQFN76
• Manufacturer: Silicon Labs

Specifications of C8051F962-A-GM

• Rohs: yes
• Core: 8051
• Processor Series: C8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 128 KB
• Data Ram Size: 8448 B
• On-chip Adc: Yes
• Operating Supply Voltage: 2.5 V to 3.3 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: DQFN-76
• Mounting Style: SMD/SMT
• Number Of Programmable I/os: 57
• Number Of Timers: 4

3.3.1. Soldering Guidelines
3.3.1.1. Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
metal pad is to be 60 m minimum, all the way around the pad.
3.3.1.2. Stencil Design
3.3.1.3. Card Assembly
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 2x2 array of 1.25 mm square openings on 1.60 mm pitch should be used for the center ground pad.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
solder paste release.
Components.
Rev. 0.5
C8051F96x
55