LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 100

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
Fig 57. Package outline SOT616-3 (HVQFN24)
LPC111X
Product data sheet
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT616-3
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
6
1
b
- - -
IEC
0.2
c
7
24
e
D
4.1
3.9
(1)
2.75
2.45
D h
e 1
D h
0
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
1/2
E
4.1
3.9
e
(1)
b
REFERENCES
Rev. 8 — 20 February 2013
19
2.75
2.45
E h
12
0.5
e
13
18
JEITA
scale
B
2.5
- - -
1/2
e
e
w
v
2.5
e 1
A
E
M
M
e 2
C
C
LPC1110/11/12/13/14/15
2.5
e 2
A
B
0.5
0.3
L
32-bit ARM Cortex-M0 microcontroller
5 mm
0.1
A
v
y 1 C
A 1
0.05
w
PROJECTION
EUROPEAN
0.05
y
detail X
0.1
y 1
X
C
y
© NXP B.V. 2013. All rights reserved.
ISSUE DATE
04-11-19
05-03-10
c
SOT616-3
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