LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 107

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
LPC111X
Product data sheet
Fig 64. Reflow soldering of the LQFP48 package
Footprint information for reflow soldering of LQFP48 package
DIMENSIONS in mm
0.500
P1
0.560
P2
10.350
Hy
Ax
solder land
occupied area
Gy
10.350 7.350
Ay
C
Bx
7.350
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 8 — 20 February 2013
0.280
Generic footprint pattern
D1
P1
0.500
D2
Hx
Gx
Bx
Ax
7.500
Gx
LPC1110/11/12/13/14/15
7.500 10.650 10.650
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
By
© NXP B.V. 2013. All rights reserved.
Ay
sot313-2_fr
SOT313-2
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