LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 3

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC111X
Product data sheet
Type number
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20
LPC1111FDH20/002
LPC1112FD20/102
LPC1112FDH20/102
LPC1112FDH28/102
LPC1114FDH28/102
LPC1114FN28/102
HVQFN24/33 and LQFP48 packages
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1111FHN33/103
LPC1111FHN33/203
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1112FHN24/202
LPC1112FHI33/202
Ordering information
[1]
[1]
[1]


Package
Name
SO20
TSSOP20
SO20
TSSOP20
TSSOP28
TSSOP28
DIP28
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN24
HVQFN33
eMetering
Alarm systems
Description
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
DIP28: plastic dual in-line package; 28 leads (600 mil)
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN24: plastic thermal enhanced very thin quad flat package; no
leads; 24 terminals; body 4 x 4 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
LPC1110/11/12/13/14/15


Lighting
White goods
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2013. All rights reserved.
Version
SOT163-1
SOT360-1
SOT163-1
SOT360-1
SOT361-1
SOT361-1
SOT117-1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
SOT616-3
n/a
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