LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 102

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
LPC111X
Product data sheet
Fig 59. Reflow soldering of the TSSOP20 package
Footprint information for reflow soldering of TSSOP20 package
DIMENSIONS in mm
0.650
P1
0.750
P2
7.200
Hy
Ay
solder land
occupied area
Gy
C
4.500
By
1.350
C
P2
D2 (4x)
0.400
D1
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.600
D2
Rev. 8 — 20 February 2013
6.900
Gx
Generic footprint pattern
P1
5.300
Gy
Hx
Gx
7.300
Hx
LPC1110/11/12/13/14/15
7.450
Hy
32-bit ARM Cortex-M0 microcontroller
(0.125)
D1
(0.125)
By
Ay
© NXP B.V. 2013. All rights reserved.
sot360-1_fr
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