LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 105

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LPC1112FHN24/2021

Manufacturer Part Number
LPC1112FHN24/2021
Description
ARM Microcontrollers - MCU
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN24/2021

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
2 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Package / Case
HVQFN-24
Mounting Style
SMD/SMT
Factory Pack Quantity
2450
NXP Semiconductors
LPC111X
Product data sheet
Fig 62. Reflow soldering of the HVQFN33 package (5x5)
Footprint information for reflow soldering of HVQFN33 package
Issue date
Dimensions in mm
0.5
P
solder land
solder paste
occupied area
5.95
Ax
11-11-15
11-11-20
5.95
Ay
4.25
Bx
see detail X
Hy
4.25
By
Gy
SLy
C
0.85
C
All information provided in this document is subject to legal disclaimers.
0.27
D
Rev. 8 — 20 February 2013
5.25
Gx
nSPx
5.25
Gy
SLx
Hx
Gx
Bx
Ax
6.2
Hx
D
nSPy
LPC1110/11/12/13/14/15
P
6.2
Hy
3.75
32-bit ARM Cortex-M0 microcontroller
SLx
By
3.75
SLy
Ay
nSPx
3
nSPy
detail X
3
© NXP B.V. 2013. All rights reserved.
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0.60
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