LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 97

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
Fig 54. Package outline (HVQFN33 5x5)
LPC111X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
(1)
max
nom
min
terminal 1
index area
terminal 1
index area
0.85
A
L
(1)
E h
0.05
0.00
8
1
A
1
32
0.30
0.18
9
b
IEC
e
0.2
c
D
5.1
4.9
(1)
D h
e 1
D
3.75
3.45
1/2 e
D
MO-220
JEDEC
h
All information provided in this document is subject to legal disclaimers.
E
5.1
4.9
b
(1)
0
References
Rev. 8 — 20 February 2013
3.75
3.45
E
25
16
h
0.5
17
24
e
JEITA
B
1/2 e
e
scale
3.5
e
w
2.5
v
A
E
1
e 2
3.5
e
C
C
2
A
LPC1110/11/12/13/14/15
0.5
0.3
B
L
0.1
v
5 mm
A
32-bit ARM Cortex-M0 microcontroller
0.05
w
y 1 C
A 1
0.05
y
European
projection
0.1
detail X
y
1
X
C
y
© NXP B.V. 2013. All rights reserved.
Issue date
11-10-11
11-10-17
c
hvqfn33f_po
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