LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 98

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
Fig 55. Package outline (HVQFN33 7x7)
LPC111X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
max
nom
min
terminal 1
index area
terminal 1
index area
1.00
0.85
0.80
A
(1)
E
0.05
0.02
0.00
L
A
h
1
8
1
0.35
0.28
0.23
b
IEC
9
32
0.2
c
e
D
7.1
7.0
6.9
(1)
33
D
4.85
4.70
4.55
e
D
D
JEDEC
1
h
h
All information provided in this document is subject to legal disclaimers.
E
7.1
7.0
6.9
(1)
b
References
Rev. 8 — 20 February 2013
4.85
4.70
4.55
0
25
E
h
16
0.65 4.55
e
JEITA
17
24
- - -
w
v
scale
B
e
e
2.5
1
C
C
e
A
E
4.55
2
A
e
2
B
LPC1110/11/12/13/14/15
0.75
0.60
0.45
L
A
5 mm
A
0.1
v
1
32-bit ARM Cortex-M0 microcontroller
0.05
w
y
1
0.08
C
y
detail X
European
projection
0.1
y
1
C
X
y
© NXP B.V. 2013. All rights reserved.
Issue date
09-03-17
09-03-23
c
hvqfn33_po
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