D12350F20IV Renesas Electronics America, D12350F20IV Datasheet - Page 211

• Manufacturer Part Number: D12350F20IV
• Description: IC H8S/2350 MCU 4.5/5.5V 0+K I-T
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12350F20IV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Type: ROMless
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

(2) Self-Refreshing
A self-refresh mode (battery backup mode) is provided for DRAM as a kind of standby mode. In
this mode, refresh timing and refresh addresses are generated within the DRAM.
To select self-refreshing, set the RFSHE bit and RMODE bit in DRAMCR to 1. Then, when a
SLEEP instruction is executed to enter software standby mode, the CAS and RAS signals are
output and DRAM enters self-refresh mode, as shown in figure 6.27.
When software standby mode is exited, the RMODE bit is cleared to 0 and self-refresh mode is
cleared.
When switching to software standby mode, if there is a CBR refresh request, CBR refreshing is
executed before self-refresh mode is entered.
CAS, LCAS
Note: n = 2 to 5
Figure 6.27 Self-Refresh Timing (When CW2 = 1, or CW2 = 0 and LCASS = 0)
CSn (RAS)
HWR (WE)
T
Rp
T
Rcr
High
Rev. 3.00 Sep 15, 2006 page 175 of 988
Software
standby
Section 6 Bus Controller
REJ09B0330-0300
T
Rc3