D12350F20IV Renesas Electronics America, D12350F20IV Datasheet - Page 645
D12350F20IV
Manufacturer Part Number
D12350F20IV
Description
IC H8S/2350 MCU 4.5/5.5V 0+K I-T
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12350F20IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Type
ROMless
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D12350F20IV
Manufacturer:
INF
Quantity:
4 834
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Restrictions on Use of DMAC or DTC
When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 clock cycles after TDR is updated by the DMAC or DTC. Misoperation
may occur if the transmit clock is input within 4 clocks after TDR is updated. (Figure 13.22)
When RDR is read by the DMAC or DTC, be sure to set the activation source to the relevant
SCI reception end interrupt (RXI).
SCK
TDRE
Serial data
Note: When operating on an external clock, set t >4 clocks.
Figure 13.22 Example of Clocked Synchronous Transmission by DTC
t
LSB
D0
D1
D2
Section 13 Serial Communication Interface (SCI)
D3
Rev. 3.00 Sep 15, 2006 page 609 of 988
D4
D5
D6
REJ09B0330-0300
D7
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