D12350F20IV Renesas Electronics America, D12350F20IV Datasheet - Page 324
D12350F20IV
Manufacturer Part Number
D12350F20IV
Description
IC H8S/2350 MCU 4.5/5.5V 0+K I-T
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12350F20IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Type
ROMless
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
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Manufacturer
Quantity
Price
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Section 7 DMA Controller (DMAC)
Figure 7.42 shows an example in which a low level is not output at the TEND pin.
Activation by Falling Edge on DREQ
DREQ pin falling edge detection is performed in synchronization with DMAC internal operations.
The operation is as follows:
[1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and
[2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and
After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer is
enabled is performed by detection of a low level.
Rev. 3.00 Sep 15, 2006 page 288 of 988
REJ09B0330-0300
switches to [2].
switches to [1].
Internal write signal
Internal read signal
External address
Figure 7.42 Example in Which Low Level Is Not Output at TEND
Internal address
HWR, LWR
TEND
DREQ
DREQ
DREQ Pin
External write by CPU, etc.
Not output
DMA
read
DMA
write
TEND
TEND
TEND Pin
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