D12350F20IV Renesas Electronics America, D12350F20IV Datasheet - Page 213

• Manufacturer Part Number: D12350F20IV
• Description: IC H8S/2350 MCU 4.5/5.5V 0+K I-T
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12350F20IV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Type: ROMless
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

6.6.2
When DRAM space is accessed in DMAC single address mode, full access (normal access) is
always performed. The DACK output goes low from the T
interface.
In modes other than DMAC single address mode, burst access can be used when accessing DRAM
space.
Figure 6.29 shows the DACK output timing for the DRAM interface when DDS = 0.
Figure 6.29 DACK
When DDS = 0
Read
Write
LCAS (LCAS)
DACK
DACK Output Timing when DDS = 0 (Example of DRAM Access)
CAS, (UCAS)
DACK
HWR, (WE)
HWR, (WE)
CSn (RAS)
D
D
A
15
15
23
DACK
to D
to D
to A
0
0
0
T
p
Row
T
r
Rev. 3.00 Sep 15, 2006 page 177 of 988
r
state in the case of the DRAM
T
c1
Column
T
Section 6 Bus Controller
c2
REJ09B0330-0300