SAK-XC866-1FRA AB Infineon Technologies, SAK-XC866-1FRA AB Datasheet - Page 113

• Manufacturer Part Number: SAK-XC866-1FRA AB
• Description: IC MCU 8BIT FLASH 38-TSSOP
• Manufacturer: Infineon Technologies
• Series: XC8xxr

Specifications of SAK-XC866-1FRA AB

• Core Processor: XC800
• Core Size: 8-Bit
• Speed: 86MHz
• Connectivity: SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 19
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 38-TSSOP
• Data Bus Width: 8 bit
• Data Ram Size: 750 B
• Interface Type: UART, SSC
• Maximum Clock Frequency: 26.67 MHz
• Number Of Programmable I/os: 27
• Number Of Timers: 3
• Operating Supply Voltage: 3.3 V, 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000235420

5
5.1
Table 47
Table 47
Parameter
Thermal resistance junction
case
Thermal resistance junction
lead
1)
Data Sheet
The thermal resistances between the case and the ambient (R
be combined with the thermal resistances between the junction and the case (R
(R
(R
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: T
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
TJA
1)
TJL
TJA
1)
) given above, in order to calculate the total thermal resistance between the junction and the ambient
can be obtained from the upper four partial thermal resistances, by
). The thermal resistances between the case and the ambient (R
provides the thermal characteristics of the package.
Package and Reliability
Package Parameters (PG-TSSOP-38)
Thermal Characteristics of the Package
Symbol
R
R
TJC
TJL
CC
CC
109
Min.
–
–
Limit Values
TCA
) , the lead and the ambient (R
Max.
15.7
39.2
TCA
J
=T
), the lead and the ambient (R
Package and Reliability
A
TJC
+ R
K/W –
K/W –
Unit Notes
), the junction and the lead
TJA
× P
D
V1.2, 2007-10
, where the R
TLA
XC866
) are to
TLA
TJA
)