X98014L128-3.3-Z Intersil, X98014L128-3.3-Z Datasheet - Page 29

• Manufacturer Part Number: X98014L128-3.3-Z
• Description: IC VIDEO DIGITIZER TRPL 128MQFP
• Manufacturer: Intersil
• Type: Video Digitizer, 3-Channel AFEr

Specifications of X98014L128-3.3-Z

• Applications: LCD TV/Monitor
• Mounting Type: Surface Mount
• Package / Case: 128-MQFP, 128-PQFP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

128-Lead Metric Quad Flat Pack (MQFP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
C0.600X0.350
(4X)
PIN 1
1
12° ALL AROUND
A
A
ALL AROUND
1
128
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
13.870±0.100
14.000±0.100
12.500 REF.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
(D1)
D1
D
For information regarding Intersil Corporation and its products, see www.intersil.com
29
4 STAND POINTS EXPOSED
DROP IN HEAT SPREADER
1
Y
SECTION A-A
b1
b
1
1
1
1
DIMENSION LIST ( FOOTPRINT: 3.200)
S/N
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
SYM
ccc
ddd
A
A1
A2
D
D1
E
E1
L
L1
T
T1
a
b
b1
e
14 x 20 mm 128 LEAD MQFP (with or without Heat spreader)
DIMENSIONS
X98014
MAX. 3.40
0.250~0.500
2.750±0.250
17.200±0.250
14.000±0.100
23.200±0.250
20.000±0.100
0.880±0.150
1.600 REF.
0°~7°
0.500 BASE
0.100
0.100
0.170±0.060
0.152±0.040
0.220±0.050
0.200±0.030
SEATING
PLANE
PACKAGE OUTLINE DRAWING
OVERALL HEIGHT
STANDOFF
PKG THICKNESS
LEAD TIP TO TIP
PKG LENGTH
LEAD TIP TO TIP
PKG WIDTH
FOOT LENGTH
LEAD LENGTH
FRAME THICKNESS
FRAME BASE METAL THICKNESS
FOOT ANGLE
LEAD WIDTH
LEAD BASE METAL WIDTH
LEAD PITCH
FOOT COPLANARITY
FOOT POSITION
REMARKS
3.2 mm FOOTPRINT
SOLUTIONS IN SILICON
b
DETAIL Y
e
ddd
0.200 MIN.
1
2
R0.25 TYP
ALL AROUND
S/N
1
2
3
4
5
6
7
C
NOTES :
GENERAL TOLERANCE.
MATTE FINISH ON PACKAGE BODY SURFACE
EXCEPT EJECTION AND PIN 1 MARKING.
ALL MOLDED BODY SHARP CORNER RADII
UNLESS OTHERWISE SPECIFIED.
PACKAGE/LEADFRAME MISALIGNMENT ( X, Y ):
TOP/BTM PACKAGE MISALIGNMENT ( X, Y ):
DRAWING DOES NOT INCLUDE PLASTIC OR METAL PROTRUSION
OR CUTTING BURR.
COMPLIANT TO JEDEC STANDARD:
L1
L
0.13~0.30
DESCRIPTION
Drawing #: MDP0055
Rev: 1
Date: 09/26/05
Units: mm
DISTANCE
ANGLE
MS-022
±0.100
±2.5°
Ra 0.8~2.0um
MAX. R0.200
MAX. 0.127
MAX. 0.127
SPECIFICATION
March 8, 2006
FN8217.3