LPC2925 NXP Semiconductors, LPC2925 Datasheet - Page 57

• Manufacturer Part Number: LPC2925
• Description: (LPC2921 - LPC2925) ARM9 microcontroller
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 31.
V
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC2921_2923_2925_0
Preliminary data sheet
Symbol
Oscillator
R
C
Power-up reset
V
V
V
DD(CORE)
www.DataSheet4U.com
s(xtal)
i
trip(high)
trip(low)
trip(dif)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
level. Cased products are tested at T
the specified temperature and power-supply voltage range.
Leakage current is exponential to temperature; worst-case value is at 125 °C T
down.
For Port 0, pin 0 to pin 15 add maximum 1.5 pF for input capacitance to ADC. For Port 0, pin 16 to pin 31 add maximum 1.0 pF for input
capacitance to ADC.
This value is the minimum drive capability. Maximum short-circuit output current is 33 mA (drive HIGH-level, shorted to ground) or
−38 mA. (drive LOW-level, shorted to V
C
The power-up reset has a time filter: V
V
Not 5 V-tolerant when pull-up is on.
For I/O Port 0, the maximum input voltage is defined by V
This parameter is not part of production testing or final testing, hence only a typical value is stated. Maximum and minimum values are
based on simulation results.
xtal
trip(low)
is crystal load capacitance and C
= V
for 11 μs before internal reset is asserted.
Static characteristics
DD(OSC_PLL)
Parameter
crystal series resistance
input capacitance
high trip level voltage
low trip level voltage
difference between high
and low trip level voltage
; V
DD(IO)
= 2.7 V to 3.6 V; V
…continued
amb
ext
DD(CORE)
DD(IO)
are the two external load capacitors.
= 25 °C (final testing). Both pre-testing and final testing use correlated test conditions to cover
Conditions
f
of XIN_OSC
f
osc
osc
). The device will be damaged if multiple outputs are shorted.
C
C
C
C
C
C
must be above V
= 10 MHz to 15 MHz
xtal
ext
xtal
ext
= 15 MHz to 20 MHz
xtal
ext
Rev. 00.01 — 24 October 2008
= 18 pF
= 39 pF
= 18 pF
= 10 pF;
= 20 pF;
= 10 pF;
DDA(ADC3V3)
I(ADC)
.
trip(high)
= 3.0 V to 3.6 V; T
for 2 μs before reset is de-asserted; V
[5]
[5]
[9]
[6]
[6]
[6]
vj
. All clocks off. Analog modules and FLASH powered
Min
-
-
-
-
1.1
1.0
50
ARM9 microcontroller with CAN and LIN
LPC2921/2923/2925
vj
= -40
°
C to +85
Typ
-
-
-
1.4
1.3
120
[1]
°
Max
160
60
80
2
1.6
1.5
180
C; all voltages are
DD(CORE)
© NXP B.V. 2008. All rights reserved.
amb
= 125 °C on wafer
must be below
57 of 81
Unit
Ω
Ω
Ω
pF
V
V
mV