LPC2925 NXP Semiconductors, LPC2925 Datasheet - Page 70

• Manufacturer Part Number: LPC2925
• Description: (LPC2921 - LPC2925) ARM9 microcontroller
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 37.
V
ground.
[1]
[2]
10. Application information
LPC2921_2923_2925_0
Preliminary data sheet
Symbol
f
f
t
i(ADC)
s(max)
conv
DD(CORE)
www.DataSheet4U.com
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Duty cycle clock should be as close as possible to 50 %.
[1]
= V
ADC dynamic characteristics
DD(OSC_PLL)
Parameter
ADC input frequency
maximum sampling rate
conversion time
10.1 Operating frequency selection
9.6 Dynamic characteristics: ADC1/2
; V
Fig 27. LPC29xx core operating frequency versus temperature for different core
DD(IO)
frequency
(MHz)
core
= 2.7 V to 3.6 V; V
145
135
125
115
105
voltages.
25
Conditions
f
f
n = resolution
In number of ADC
clock cycles
In number of bits
i(ADC)
s
V
= f
resolution 2 bit
resolution 10 bit
DD(CORE)
V
V
DD(CORE)
DD(CORE)
Rev. 00.01 — 24 October 2008
i(ADC)
= 4.5 MHz;
DDA(ADC3V3)
/(n + 1) with
= 1.65 V
= 1.95 V
= 1.8 V
amb
= 25 °C (final testing). Both pre-testing and final testing use correlated
45
= 3.0 V to 3.6 V; all voltages are measured with respect to
[2]
ARM9 microcontroller with CAN and LIN
Min
4
-
-
3
2
LPC2921/2923/2925
65
Typ
-
-
-
-
-
temperature (°C)
Max
4.5
1500
400
11
10
002aae194
© NXP B.V. 2008. All rights reserved.
amb
= 125 °C ambient
85
Unit
MHz
ksampl
e/s
ksampl
e/s
cycles
bits
70 of 81