LPC2925 NXP Semiconductors, LPC2925 Datasheet - Page 65

• Manufacturer Part Number: LPC2925
• Description: (LPC2921 - LPC2925) ARM9 microcontroller
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 34.
V
ground; positive currents flow into the IC; unless otherwise specified
[1]
[2]
[3]
LPC2921_2923_2925_0
Preliminary data sheet
Symbol
t
t
t
t
t
t
t
t
t
t
f(o)
r
f
BUF
LOW
HD;STA
HIGH
SU;DAT
SU;STA
SU;STO
DD(CORE)
Fig 22. I
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All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
SDA
SCL
= V
2
Dynamic characteristic: I
C-bus pins clock timing
P
DD(OSC_PLL)
9.3 Dynamic characteristics: I
Parameter
output fall time
rise time
fall time
bus free time between a STOP and
START condition
LOW period of the SCL clock
hold time (repeated) START
condition
HIGH period of the SCL clock
data set-up time
set-up time for a repeated START
condition
set-up time for STOP condition
t
BUF
b
in pF, from 10 pF to 400 pF.
; V
S
t
HD;STA
DD(IO)
= 2.7 V to 3.6 V; V
t
LOW
2
C-bus pins
t
t r
HD;STA
Rev. 00.01 — 24 October 2008
DDA(ADC3V3)
t
HIGH
Conditions
V
-
-
-
-
-
-
-
amb
IH
to V
= 25 °C (final testing). Both pre-testing and final testing use correlated
2
C-bus interface
t
= 3.0 V to 3.6 V; all voltages are measured with respect to
IL
f
t
SU;DAT
[1]
S
ARM9 microcontroller with CAN and LIN
<tbd>
Min
20 + 0.1 × C
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
t
LPC2921/2923/2925
SU;STA
b
t
HD;STA
[3]
Typ
-
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
[2]
© NXP B.V. 2008. All rights reserved.
amb
Max
-
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
= 125 °C ambient
t
002aad985
SU;STO
P
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Unit
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