mt48lc4m32b2tg-7-it Micron Semiconductor Products, mt48lc4m32b2tg-7-it Datasheet - Page 66

• Manufacturer Part Number: mt48lc4m32b2tg-7-it
• Description: 128mb X32 Sdram
• Manufacturer: Micron Semiconductor Products

Figure 50:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. K 9/07 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
for production devices. Although considered final, these specifications are subject to change, as further product
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
A
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
0.25mm per side.
3.20
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
their respective owners.
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
66
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
BALL A1 ID