MT48LC32M16A2P-75 L:C TR Micron Technology Inc, MT48LC32M16A2P-75 L:C TR Datasheet - Page 11

• Manufacturer Part Number: MT48LC32M16A2P-75 L:C TR
• Description: IC SDRAM 512MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT48LC32M16A2P-75 L:C TR

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-TSOP II
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Functional Description
Initialization
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
1. Simultaneously apply power to V
2. Assert and hold CKE at a LVTTL logic LOW since all inputs and outputs are LVTTL-
3. Provide stable CLOCK signal. Stable clock is defined as a signal cycling within timing
4. Wait at least 100µs prior to issuing any command other than a COMMAND INHIBIT
5. Starting at some point during this 100µs period, bring CKE HIGH. Continuing at least
6. Perform a PRECHARGE ALL command.
The 512Mb SDRAMs (32 Meg x 4 x 4 banks, 16 Meg x 8 x 4 banks, and 8 Meg x 16 x 4
banks) are quad-bank DRAMs that operate at 3.3V and include a synchronous interface
(all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s
134,217,728-bit banks is organized as 8,192 rows by 4,096 columns by 4 bits. Each of the
x8’s 134,217,728-bit banks is organized as 8,192 rows by 2,048 columns by 8 bits. Each of
the x16’s 134,217,728-bit banks is organized as 8,192 rows by 1,024 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1
select the bank, A0–A12 select the row). The address bits (x4: A0–A9, A11, A12; x8: A0–A9,
A11; x16: A0–A9) registered coincident with the READ or WRITE command are used to
select the starting column location for the burst access.
Prior to normal operation, the SDRAM must be initialized. The following sections
provide detailed information covering device initialization, register definition,
command descriptions, and device operation.
SDRAMs must be powered up and initialized in a predefined manner. Operational
procedures other than those specified may result in undefined operation. After power is
applied to V
defined as a signal cycling within timing constraints specified for the clock pin), the
SDRAM requires a 100µs delay prior to issuing any command other than a COMMAND
INHIBIT or NOP . Starting at some point during this 100µs period and continuing at least
through the end of this period, COMMAND INHIBIT or NOP commands should be
applied.
After the 100µs delay has been satisfied with at least one COMMAND INHIBIT or NOP
command having been applied, a PRECHARGE command should be applied. All banks
must then be precharged, thereby placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO
REFRESH cycles are complete, the SDRAM is ready for mode register programming.
Because the mode register will power up in an unknown state, it should be loaded prior
to applying any operational command.
If desired, the two AUTO REFRESH commands can be issued after the LMR command.
The recommended power-up sequence for SDRAMs:
compatible.
constraints specified for the clock pin.
or NOP.
through the end of this period, one or more COMMAND INHIBIT or NOP commands
must be applied.
DD
and V
DD
Q (simultaneously) and the clock is stable (stable clock is
11
DD
and V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
Q.
512Mb: x4, x8, x16 SDRAM
Functional Description
©2000 Micron Technology, Inc. All rights reserved.