MT48LC32M16A2P-75 L:C TR Micron Technology Inc, MT48LC32M16A2P-75 L:C TR Datasheet - Page 22

IC SDRAM 512MBIT 133MHZ 54TSOP

MT48LC32M16A2P-75 L:C TR

Manufacturer Part Number
MT48LC32M16A2P-75 L:C TR
Description
IC SDRAM 512MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT48LC32M16A2P-75 L:C TR

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
512M (32Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 10:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
CAS Latency
COMMAND
COMMAND
Upon completion of a burst, assuming no other commands have been initiated, the DQs
will go High-Z. A full-page burst will continue until terminated (at the end of the page, it
will wrap to the start address and continue). Data from any READ burst may be trun-
cated with a subsequent READ command, and data from a fixed-length READ burst may
be immediately followed by data from a READ command.
In either case, a continuous flow of data can be maintained. The first data element from
the new burst either follows the last element of a completed burst or the last desired data
element of a longer burst that is being truncated. The new READ command should be
issued x cycles before the clock edge at which the last desired data element is valid,
where x = CL - 1. This is shown in Figure 10 for CL = 2 and CL = 3; data element n + 3 is
either the last of a burst of four or the last desired of a longer burst.
The 512Mb SDRAM uses a pipelined architecture and therefore does not require the 2n
rule associated with a prefetch architecture. A READ command can be initiated on any
clock cycle following a previous READ command. Full-speed random read accesses can
be performed to the same bank, as shown in Figure 12 on page 24, or each subsequent
READ may be performed to a different bank.
CLK
CLK
DQ
DQ
READ
READ
T0
T0
CL = 2
NOP
NOP
T1
T1
22
t
t AC
LZ
CL = 3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T2
NOP
T2
NOP
t
t AC
LZ
D
t OH
OUT
512Mb: x4, x8, x16 SDRAM
T3
T3
NOP
D
t OH
OUT
Don’t Care
Undefined
©2000 Micron Technology, Inc. All rights reserved.
T4
Operations

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