MD5811-D256-V3Q18-P SanDisk, MD5811-D256-V3Q18-P Datasheet - Page 67

• Manufacturer Part Number: MD5811-D256-V3Q18-P
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.7 Boot Replacement
A typical RISC architecture uses a boot ROM for system initialization. The boot ROM is also
required to access Mobile DiskOnChip P3 during the boot sequence in order to load OS images and
the device drivers.
M-Systems’ Boot Software Development Kit (BDK) and DOS utilities enable full control of Mobile
DiskOnChip P3 during the boot sequence. For a complete description of these products, refer to the
DiskOnChip Boot Software Development Kit (BDK) developer guide and the DiskOnChip Software
Utilities user manual. These tools enable the following operations:
•
•
•
Figure 21 illustrates the system boot flow using Mobile DiskOnChip P3 in a RISC architecture.
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Formatting Mobile DiskOnChip P3
Creating multiple partitions for different storage needs (OS images files, register entry files,
back-up partitions, and FAT/NFTL partition)
Loading the OS image file
Boot Loader
RAM
Basic System Initialization
Boot Loader Copies
OS Image to RAM
OS Start-Up Code
Power-Up
Figure 21: System Boot Flow with Mobile DiskOnChip P3
OS Image
Data Sheet, Rev. 0.3
Copy Image
to RAM
DiskOnChip P3
Take Image from
Mobile DiskOnChip P3
(OS Image Storage)
Flash Disk Partition
BInary Partition
(File Storage)
Mobile DiskOnChip P3
93-SR-009-8L