MC68HC705C8ACFNE Freescale Semiconductor, MC68HC705C8ACFNE Datasheet - Page 194

• Manufacturer Part Number: MC68HC705C8ACFNE
• Description: IC MCU 8K 2.1MHZ OTP 44-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C8ACFNE

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• Ram Size: 304 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-PLCC
• A/d Inputs: 4-Channel, 8-Bit
• Eeprom Memory: 0 Bytes
• Input Output: 24
• Interface: SCI/SPI
• Memory Type: OTP
• Number Of Bits: 8
• Package Type: 44-pin PLCC
• Programmable Memory: 8K Bytes
• Timers: 3-16-bit
• Voltage, Range: 3-5.5 V
• Processor Series: HC705C
• Core: HC05
• Data Bus Width: 8 bit
• Data Ram Size: 304 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 2.1 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: RoHS Compliant part

Mechanical Specifications
14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC)
Technical Data
194
-L-
C
0.010 (0.25)
Z
44
Figure 14-3. MC68HC705C8AFN Package Dimensions (Case #777)
G
G1
S
A
R
T
1
L-M
-N-
V
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSION R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMINSION H DOES NOT INCLUDE DAMBAR
S
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM -T-, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940198). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
Freescale Semiconductor, Inc.
N S
For More Information On This Product,
E
Y
BRK
-M-
0.007(0.180)
0.007(0.180)
W
J
VIEW S
D
Go to: www.freescale.com
D
Mechanical Specifications
-T-
M
M
T
T
0.004 (0.10)
SEATING
PLANE
L-M
L-M
S
S
DIM
G1
K1
W
G
A
B
C
E
F
H
K
R
U
V
X
Y
Z
J
N S
N S
0.042
MIN
0.685
0.685
0.165
0.090
0.013
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.610
0.040
2
0.050 BSC
INCHES
B
X
Z
K
VIEW D-D
MAX
0.695
0.695
0.180
0.110
0.019
0.032
0.656
0.656
0.048
0.048
0.056
0.020
0.630
10
U
VIEW S
0.007(0.180)
H
17.40
17.40
16.51
16.51
15.50
MIN
MILLIMETERS
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
2
1.27 BSC
0.007(0.180)
0.007(0.180)
MAX
F
17.65
17.65
16.66
16.66
16.00
10
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
K1
M
0.007(0.180)
G1
0.010 (0.25)
T
MC68HC705C8A — Rev. 3
M
M
L-M
T
T
S
M
L-M
L-M
S
N S
T
T
S
S
L-M
L-M
N S
N S
S
S
N S
N S