MCF5282CVM66 Freescale, MCF5282CVM66 Datasheet - Page 600
MCF5282CVM66
Manufacturer Part Number
MCF5282CVM66
Description
Manufacturer
Freescale
Datasheet
1.MCF5282CVM66.pdf
(766 pages)
Specifications of MCF5282CVM66
Cpu Family
MCF528x
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Interface Type
CAN/I2C/QSPI/UART
Total Internal Ram Size
64KB
# I/os (max)
150
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
3.3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
MA-BGA
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant
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Queued Analog-to-Digital Converter (QADC)
Other suggestions for PCB layout in which the QADC is employed include:
28.9.5
Positive or negative stress refers to conditions which exceed nominally defined operating limits. Examples
include applying a voltage exceeding the normal limit on an input (for example, voltages outside of the
suggested supply/reference ranges) or causing currents into or out of the pin which exceed normal limits.
QADC specific considerations are voltages greater than V
which cause excessive currents into or out of the input. Refer to
for more information on exact magnitudes.
Either stress conditions can potentially disrupt conversion results on neighboring inputs. Parasitic devices,
associated with CMOS processes, can cause an immediate disruptive influence on neighboring pins.
Common examples of parasitic devices are diodes to substrate and bipolar devices with the base terminal
tied to substrate (V
cause errors on the selected channel by developing a voltage drop across the selected channel’s
impedances.
28-62
•
•
•
•
•
Analog ground must be low impedance to all analog ground points in the circuit.
Bypass capacitors should be as close to the power pins as possible.
The analog ground should be isolated from the digital ground. This can be done by cutting a
separate ground plane for the analog ground.
Non-minimum traces should be utilized for connecting bypass capacitors and filters to their
corresponding ground/power points.
Minimum distance for trace runs when possible.
Accommodating Positive/Negative Stress Conditions
PCB
+5 V
SS
/V
Figure 28-49. Star-Ground at the Point of Power Supply Origin
SSA
Analog Power Supply
ground). Under stress conditions, current injected on an adjacent signal can
AGND
QADC
+5 V
V
V
DD
SS
DDA
or less than V
Chapter 33, “Electrical
PGND
Digital Power Supply
SSA
applied to an analog input
+5 V
Freescale Semiconductor
Characteristics”
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