MC7448VU1700LD Freescale Semiconductor, MC7448VU1700LD Datasheet - Page 12

• Manufacturer Part Number: MC7448VU1700LD
• Description: IC MPU RISC 32BIT 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7448VU1700LD

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.7GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Electrical and Thermal Characteristics
Table 5
thermal management, see
Table 6
12
At recommended operating conditions. See
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
Notes:
1. Refer to
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
3. Per JEDEC JESD51-2 with the single-layer board horizontal
4. Per JEDEC JESD51-6 with the board horizontal
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Input high voltage
(all inputs)
Input low voltage
(all inputs)
Input leakage current, all signals except
BVSEL0, LSSD_MODE, TCK, TDI, TMS,
TRST:
V
V
Input leakage current, BVSEL0,
LSSD_MODE, TCK, TDI, TMS, TRST:
V
V
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
Method 1012.1) with the calculated case temperature. The actual value of R
in
in
in
in
= OV
= GND
= OV
= GND
provides the package thermal characteristics for the MPC7448. For more information regarding
provides the DC electrical characteristics for the MPC7448.
DD
DD
Section 9.7, “Power and Thermal Management Information,”
Characteristic
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Section 9.7, “Power and Thermal Management Information.”
Characteristic
Table 5. Package Thermal Characteristics
Table
Table 6. DC Electrical Specifications
4.
Nominal Bus
Voltage
1.5
1.8
2.5
1.5
1.8
2.5
—
—
1
Symbol
V
V
I
I
in
in
IH
IL
for details about thermal management.
OV
OV
θJC
DD
DD
–0.3
–0.3
–0.3
for the part is less than 0.1°C/W.
Min
1.7
—
—
× 0.65
× 0.65
1
Symbol
R
R
R
R
R
R
θ
θ
θ
θ
θ
θ
JMA
JMA
JMA
JC
JA
JB
OV
OV
OV
OV
OV
– 2000
DD
DD
Max
DD
DD
DD
– 50
0.7
50
50
× 0.35
× 0.35
Value
< 0.1
Freescale Semiconductor
+ 0.3
+ 0.3
+ 0.3
26
19
22
16
11
Unit
•C/W
•C/W
•C/W
•C/W
•C/W
•C/W
Unit
µA
µA
C/W
C/W
C/W
C/W
C/W
C/W
V
V
Notes
2, 3
2, 6
Notes
2
2
2, 3
2, 4
2, 4
2, 4
5
6