MC7448VU1700LD Freescale Semiconductor, MC7448VU1700LD Datasheet - Page 50

• Manufacturer Part Number: MC7448VU1700LD
• Description: IC MPU RISC 32BIT 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7448VU1700LD

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.7GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
9.7.3
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
During operation, the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30 to 40 C. The air temperature rise within a cabinet (T
10 C. The thermal resistance of the thermal interface material (R
example, assuming a T
(P
Die-junction temperature: T
For this example, a R
below the maximum value of
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, and so on.
50
d
) of 25.6 W, the following expression for T
4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Laird Technologies - Thermal
(formerly Thermagon Inc.)
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.lairdtech.com
T
T
T
R
R
R
P
d
i
r
j
θJC
θint
θsa
is the die-junction temperature
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the power dissipated by the device
Heat Sink Selection Example
is the heat sink base-to-ambient thermal resistance
is the junction-to-case thermal resistance
is the adhesive or interface material thermal resistance
T
j
θsa
= T
i
of 30 C, a T
value of 1.53 C/W or less is required to maintain the die junction temperature
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
i
+ T
j
Table
r
= 30 C + 5 C + (0.1 C/W + 1.1 C/W + θ
+ (R
θJC
4.
r
of 5 C, an HCTE package R
+ R
θint
j
+ R
is obtained:
j
θsa
) should be maintained less than the value specified in
) × P
d
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θint
θJC
) is typically about 1.1 C/W. For
= 0.1, and a power consumption
r
) may be in the range of 5 to
sa
) × 25.6
Freescale Semiconductor
i
)