MC7448VU1700LD Freescale Semiconductor, MC7448VU1700LD Datasheet - Page 46

• Manufacturer Part Number: MC7448VU1700LD
• Description: IC MPU RISC 32BIT 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7448VU1700LD

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.7GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
9.7
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7448 implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see
“Power Consumption with DFS Enabled,”
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see
printed-circuit board is suggested. In any implementation of a heat sink solution, the force on the die
should not exceed ten pounds (45 Newtons).
46
Figure 22. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Power and Thermal Management Information
Figure
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in
22); however, due to the potential large mass of the heat sink, attachment through the
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Interface Material
Heat Sink
Thermal
Heat Sink
Clip
for specific information regarding power reduction and DFS.
Printed-Circuit Board
Section 9.7.4, “Temperature Diode,”
NOTE
Figure
HCTE BGA Package
23.
Freescale Semiconductor
for more
Section 9.7.5.1,