SC18IS602BIPW,112 NXP Semiconductors, SC18IS602BIPW,112 Datasheet - Page 19

• Manufacturer Part Number: SC18IS602BIPW,112
• Description: IC BRIDGE SPI/I2C 16-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of SC18IS602BIPW,112

• Controller Type: I²C Bus Controller
• Interface: I²C
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Operating Temperature Classification: Military
• Operating Temperature (max): 125C
• Package Type: TSSOP
• Rad Hardened: No
• Maximum Operating Frequency: 4.5 MHz
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.4 V
• For Use With: 568-4705 - DEMO BOARD I2C TO SPI SC18IS602
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4785-5; 935286182112; SC18IS602BIPW; SC18IS602BIPW,112; SC18IS602BIPW

NXP Semiconductors
12. Package outline
Fig 23. Package outline SOT403-1 (TSSOP16)
SC18IS602_602B_603_4
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
Rev. 04 — 11 March 2008
(1)
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
SC18IS602/602B/603
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
I
2
C-bus to SPI bridge
X
v
0.1
A
© NXP B.V. 2008. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o
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