SC18IS602BIPW,112 NXP Semiconductors, SC18IS602BIPW,112 Datasheet - Page 25

• Manufacturer Part Number: SC18IS602BIPW,112
• Description: IC BRIDGE SPI/I2C 16-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of SC18IS602BIPW,112

• Controller Type: I²C Bus Controller
• Interface: I²C
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Operating Temperature Classification: Military
• Operating Temperature (max): 125C
• Package Type: TSSOP
• Rad Hardened: No
• Maximum Operating Frequency: 4.5 MHz
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.4 V
• For Use With: 568-4705 - DEMO BOARD I2C TO SPI SC18IS602
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4785-5; 935286182112; SC18IS602BIPW; SC18IS602BIPW,112; SC18IS602BIPW

NXP Semiconductors
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
7.1.10
7.1.11
7.1.11.1
7.1.11.2
7.1.11.3
7.1.11.4
7.2
7.3
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 16
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering of SMD packages . . . . . . . . . . . . . . 20
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Contact information. . . . . . . . . . . . . . . . . . . . . 24
2
C-bus to SPI communications example . . . 14
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
I
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Write to data buffer . . . . . . . . . . . . . . . . . . . . . . 5
SPI read and write - Function ID 01h to 0Fh . . 5
Read from buffer . . . . . . . . . . . . . . . . . . . . . . . . 6
Configure SPI Interface - Function ID F0h . . . . 7
Clear Interrupt - Function ID F1h . . . . . . . . . . . 8
Idle mode - Function ID F2h . . . . . . . . . . . . . . . 8
GPIO Write - Function ID F4h . . . . . . . . . . . . . 8
GPIO Read - Function ID F5h . . . . . . . . . . . . . 9
GPIO Enable - Function ID F6h . . . . . . . . . . . . 9
GPIO Configuration - Function ID F7h . . . . . . 10
Quasi-bidirectional output configuration . . . . . 10
Open-drain output configuration . . . . . . . . . . . 11
Input-only configuration . . . . . . . . . . . . . . . . . 12
Push-pull output configuration . . . . . . . . . . . . 12
External clock input (SC18IS603). . . . . . . . . . 13
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering . . . . . . . . . . . . . . . . . 20
Wave and reflow soldering . . . . . . . . . . . . . . . 20
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2
C-bus interface . . . . . . . . . . . . . . . . . . . . . . . . 4
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SC18IS602/602B/603
Document identifier: SC18IS602_602B_603_4
I
2
C-bus to SPI bridge
Date of release: 11 March 2008
All rights reserved.