SC18IS602BIPW,112 NXP Semiconductors, SC18IS602BIPW,112 Datasheet - Page 22

• Manufacturer Part Number: SC18IS602BIPW,112
• Description: IC BRIDGE SPI/I2C 16-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of SC18IS602BIPW,112

• Controller Type: I²C Bus Controller
• Interface: I²C
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Operating Temperature Classification: Military
• Operating Temperature (max): 125C
• Package Type: TSSOP
• Rad Hardened: No
• Maximum Operating Frequency: 4.5 MHz
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.4 V
• For Use With: 568-4705 - DEMO BOARD I2C TO SPI SC18IS602
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4785-5; 935286182112; SC18IS602BIPW; SC18IS602BIPW,112; SC18IS602BIPW

NXP Semiconductors
14. Abbreviations
SC18IS602_602B_603_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 16.
Acronym
CDM
CPU
EEPROM
ESD
GPIO
HBM
I/O
I
LSB
MM
MSB
SPI
2
Fig 24. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Charged Device Model
Central Processing Unit
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Input/Output
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Serial Peripheral Interface
Rev. 04 — 11 March 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SC18IS602/602B/603
temperature
peak
I
2
C-bus to SPI bridge
© NXP B.V. 2008. All rights reserved.
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