L6711TR STMicroelectronics, L6711TR Datasheet - Page 11

• Manufacturer Part Number: L6711TR
• Description: IC CTRLR 3PHASE VID/DACS 48-TQFP
• Manufacturer: STMicroelectronics
• Type: Step-Down (Buck)r

Specifications of L6711TR

• Internal Switch(s): No
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 1.55 V
• Current - Output: 2A
• Frequency - Switching: 150kHz
• Voltage - Input: 12V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP Exposed Pad, 48-eTQFP, 48-HTQFP, 48-VQFP
• Power - Output: 2.5W
• Output Voltage: 0.8 V to 1.581 V
• Output Current: 95 A
• Input Voltage: 13.8 V
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5363-2; L6711TR

L6711
Table 1.
PAD
N°
45
46
47
48
THERMAL
UGATE1
PHASE1
BOOT1
Name
N.C.
PAD
Pins description
Channel 1 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC
(cathode vs. boot).
Channel 1 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides
the return path for the HS driver of channel 1.
Not internally connected.
Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to
dissipate the power necessary to drive the external mosfets. Connect to the GND plane with
several vias to improve thermal conductivity.
(continued)
Description
Pins description and connection diagrams
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