LPC2929FBD144,551 NXP Semiconductors, LPC2929FBD144,551 Datasheet - Page 76

• Manufacturer Part Number: LPC2929FBD144,551
• Description: IC ARM9 MCU FLASH 768K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2929FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 768KB (768K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 104
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC29
• Core: ARM968E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 56 KB
• Interface Type: CAN/UART/USB
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2929, MCB2929U, MCB2929UME
• Development Tools By Supplier: OM11026, OM11038
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3 (8-ch x 10-bit)
• Package: 144LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Maximum Speed: 125 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4786 - EXT BOARD MOTOR CONTROL LPC2900
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4695; 935287118551; LPC2929FBD144-S

NXP Semiconductors
Table 39.
V
T
specified.
[1]
LPC2926_27_29
Product data sheet
Symbol
f
t
SPI
su(SPI_MISO)
vj
DD(CORE)
=
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
−
40
°
[1]
C to +85
= V
Dynamic characteristics of SPI pins
DD(OSC_PLL)
Parameter
SPI operating frequency
SPI_MISO set-up time
9.4 Dynamic characteristics: SPI
°
C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
; V
Fig 27. SPI data input set-up time in SSP Master mode
DD(IO)
SDOn
SCKn
shifting edges
SDIn
= 2.7 V to 3.6 V; V
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 28 September 2010
Conditions
master operation
slave operation
T
measured in
SPI Master
mode; see
Figure 27
amb
DDA(ADC3V3)
= 25 °C;
amb
= 25 °C (final testing). Both pre-testing and final testing use correlated
= 3.0 V to 3.6 V; V
t
su(SPI_MISO)
ARM9 microcontroller with CAN, LIN, and USB
Min
1
1
-
LPC2926/2927/2929
⁄
⁄
65024
65024
DDA(ADC5V0)
f
f
clk(SPI)
clk(SPI)
Typ
-
-
11
= 3.0 V to 5.5 V;
sampling edges
Max
1
1
-
© NXP B.V. 2010. All rights reserved.
⁄
⁄
2
4
amb
f
f
clk(SPI)
clk(SPI)
= 85 °C ambient
002aae695
Unit
MHz
MHz
ns
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