LPC2929FBD144,551 NXP Semiconductors, LPC2929FBD144,551 Datasheet - Page 95

• Manufacturer Part Number: LPC2929FBD144,551
• Description: IC ARM9 MCU FLASH 768K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2929FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 768KB (768K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 104
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC29
• Core: ARM968E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 56 KB
• Interface Type: CAN/UART/USB
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2929, MCB2929U, MCB2929UME
• Development Tools By Supplier: OM11026, OM11038
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3 (8-ch x 10-bit)
• Package: 144LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Maximum Speed: 125 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4786 - EXT BOARD MOTOR CONTROL LPC2900
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4695; 935287118551; LPC2929FBD144-S

NXP Semiconductors
6.15.6.2
6.15.7
6.15.7.1
6.15.7.2
6.16
6.16.1
6.16.2
6.16.2.1
6.16.2.2
6.16.2.3
6.16.3
6.16.3.1
6.16.4
6.16.4.1
6.16.4.2
6.16.5
6.16.5.1
6.17
6.17.1
6.17.2
7
8
8.1
8.2
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
10
10.1
10.2
10.3
10.4
10.5
11
12
12.1
12.2
12.3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 61
Static characteristics. . . . . . . . . . . . . . . . . . . . 63
Dynamic characteristics . . . . . . . . . . . . . . . . . 72
Application information. . . . . . . . . . . . . . . . . . 80
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 86
Soldering of SMD packages . . . . . . . . . . . . . . 87
Power, Clock and Reset Control Subsystem
(PCRSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Dynamic characteristics: I/O and
CLK_OUT pins, internal clock, oscillators,
PLL, and CAN. . . . . . . . . . . . . . . . . . . . . . . . . 72
Dynamic characteristics: I
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
(PCB) layout guidelines . . . . . . . . . . . . . . . . . 85
Wave and reflow soldering . . . . . . . . . . . . . . . 87
Clock description . . . . . . . . . . . . . . . . . . . . . . 47
Quadrature Encoder Interface (QEI) . . . . . . . 47
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 48
Clock description . . . . . . . . . . . . . . . . . . . . . . 48
Clock description . . . . . . . . . . . . . . . . . . . . . . 49
Clock Generation Unit (CGU0) . . . . . . . . . . . . 50
Functional description. . . . . . . . . . . . . . . . . . . 50
PLL functional description . . . . . . . . . . . . . . . 53
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 54
Clock generation for USB (CGU1) . . . . . . . . . 55
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 55
Reset Generation Unit (RGU). . . . . . . . . . . . . 55
Functional description. . . . . . . . . . . . . . . . . . . 56
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 57
Power Management Unit (PMU). . . . . . . . . . . 57
Functional description. . . . . . . . . . . . . . . . . . . 57
Vectored Interrupt Controller (VIC) . . . . . . . . . 59
Functional description. . . . . . . . . . . . . . . . . . . 60
Clock description . . . . . . . . . . . . . . . . . . . . . . 60
Power consumption . . . . . . . . . . . . . . . . . . . . 68
Electrical pin characteristics . . . . . . . . . . . . . . 69
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 74
Dynamic characteristics: SPI . . . . . . . . . . . . . 76
Dynamic characteristics: ADC . . . . . . . . . . . . 80
Operating frequency selection . . . . . . . . . . . . 80
Suggested USB interface solutions . . . . . . . . 82
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 84
XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . . 85
XIN_OSC Printed Circuit Board
Introduction to soldering . . . . . . . . . . . . . . . . . 87
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 87
2
C-bus interface. . . 75
12.4
13
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
ARM9 microcontroller with CAN, LIN, and USB
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 90
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Revision history . . . . . . . . . . . . . . . . . . . . . . . 91
Legal information . . . . . . . . . . . . . . . . . . . . . . 92
Contact information . . . . . . . . . . . . . . . . . . . . 93
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 88
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 92
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 93
LPC2926/2927/2929
Document identifier: LPC2926_27_29
Date of release: 28 September 2010
All rights reserved.