LPC2929FBD144,551 NXP Semiconductors, LPC2929FBD144,551 Datasheet - Page 85

• Manufacturer Part Number: LPC2929FBD144,551
• Description: IC ARM9 MCU FLASH 768K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2929FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 768KB (768K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 104
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC29
• Core: ARM968E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 56 KB
• Interface Type: CAN/UART/USB
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2929, MCB2929U, MCB2929UME
• Development Tools By Supplier: OM11026, OM11038
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3 (8-ch x 10-bit)
• Package: 144LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Maximum Speed: 125 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4786 - EXT BOARD MOTOR CONTROL LPC2900
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4695; 935287118551; LPC2929FBD144-S

NXP Semiconductors
LPC2926_27_29
Product data sheet
10.4 XIN_OSC input
10.5 XIN_OSC Printed Circuit Board (PCB) layout guidelines
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
capacitor to ground C
mode, a minimum of 200 mV (RMS) is needed. For more details see the LPC29xx User
manual UM10316.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
smaller accordingly to the increase in parasitics of the PCB layout.
Fig 38. Slave mode operation of the on-chip oscillator
i
= 100 pF. To limit the input voltage to the specified range, choose an additional
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 28 September 2010
g
which attenuates the input voltage by a factor C
XIN_OSC
ARM9 microcontroller with CAN, LIN, and USB
C i
100 pF
LPC29xx
LPC2926/2927/2929
002aae730
C g
x1
and C
x2
x1
should be chosen
and C
i
/(C
© NXP B.V. 2010. All rights reserved.
x2
i
, and C
+ C
g
). In slave
x3
85 of 95
in