D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 328
D6417709SHF200BV
Manufacturer Part Number
D6417709SHF200BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SHF200BV
Core Processor
SH-3
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
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Part Number:
D6417709SHF200BV
Manufacturer:
Renesas Electronics America
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10 000
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independently for areas 2 and 3 by means of bits A2W1 and A2W0 or A3W1 and A3W0 in
WCR2. This number of cycles corresponds to the number of synchronous DRAM CAS latency
cycles.
Rev. 5.00, 09/03, page 282 of 760
CKIO
A25 to A16,
A13
A12
A15, A14,
A11 to A0
CS2 or CS3
RAS3x
CASx
RD/WR
DQMxx
D31 to D0
BS
Figure 10.14 Basic Timing for Synchronous DRAM Burst Read
Tr
Tc1
Tc2/Td1
Tc3/Td2
Tc4/Td3
Td4
Tpc
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