D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 403
D6417709SHF200BV
Manufacturer Part Number
D6417709SHF200BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SHF200BV
Core Processor
SH-3
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SHF200BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 403 of 809
- Download datasheet (5Mb)
Single Address Mode
In single address mode, either the transfer source or transfer destination peripheral device is
accessed (selected) by means of the DACK signal, and the other device is accessed by address.
In this mode, the DMAC performs one DMA transfer in one bus cycle, accessing one of the
external devices by outputting the DACK transfer request acknowledge signal to it, and at the
same time outputting an address to the other device involved in the transfer. For example, in
the case of transfer between external memory and an external device with DACK shown in
figure 11.9, when the external device outputs data to the data bus, that data is written to the
external memory in the same bus cycle.
Two kinds of transfer are possible in single address mode: (1) transfer between an external
device with DACK and a memory-mapped external device, and (2) transfer between an
external device with DACK and external memory. In both cases, only the external request
signal (DREQ) is used for transfer requests.
Figures 11.10 and 11.11 show examples of DMA transfer timing in single address mode.
SH7709S
Data flow
DMAC
Figure 11.9 Data Flow in Single Address Mode
External address bus
DACK
DREQ
External data bus
Rev. 5.00, 09/03, page 357 of 760
External device
with DACK
External
memory
Related parts for D6417709SHF200BV
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
KIT STARTER FOR M16C/29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/2D
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
R0K33062P STARTER KIT
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/23 E8A
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/25
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER H8S2456 SHARPE DSPLY
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C38C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C35C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8CL3AC+LCD APPS
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR RX610
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R32C/118
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV RSK-R8C/26-29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR SH7124
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR H8SX/1622
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV FOR SH7203
Manufacturer:
Renesas Electronics America
Datasheet: