D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 358
D6417709SHF200BV
Manufacturer Part Number
D6417709SHF200BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SHF200BV
Core Processor
SH-3
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SHF200BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Memory Card Interface Burst Timing: In the SH7709S, when the IC memory card interface is
selected, page mode burst access mode can be used, for read access only, by setting bits A5BST1
and A5BST0 in BCR1 for physical space area 5, or bits A6BST1 and A6BST0 in BCR1 for area
6. This burst access mode is not stipulated in JEIDA version 4.2 (PCMCIA2.1), but allows high-
speed data access using ROM provided with a burst mode, etc.
Burst access mode timing is shown in figures 10.34 and 10.35.
Rev. 5.00, 09/03, page 312 of 760
CKIO
A25 to A4
A3 to A0
CExx
RD/WR
RD
(read)
D15 to D0
(read)
BS
Figure 10.34 Basic Timing for PCMCIA Memory Card Interface Burst Access
Tpcm1
Tpcm2
Tpcm1
Tpcm2
Tpcm1
Tpcm2
Tpcm1
Tpcm2
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