ATSAM3S4AA-MU Atmel, ATSAM3S4AA-MU Datasheet - Page 1093

• Manufacturer Part Number: ATSAM3S4AA-MU
• Description: IC MCU 32BIT 256KB FLASH 48QFN
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4AA-MU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 8x10/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

6500C–ATARM–8-Feb-11
Table 42-14. 64-pad QFN Package Dimensions (in mm)
Table 42-15. Device and QFN Package Maximum Weight (Preliminary)
Table 42-16. QFN Package Reference
Table 42-17. QFN Package Characteristics
This package respects the recommendations of the NEMI User Group.
SAM3S4/2/1
JEDEC Drawing Reference
JESD97 Classification
Moisture Sensitivity Level
Symbol
aaa
bbb
ccc
A1
A2
A3
D2
E2
D
R
A
E
b
L
e
0.125
0.23
6.95
6.95
0.35
Min
–
–
–
Millimeter
0.20 REF
9.00 bsc
9.00 bsc
0.50 bsc
Nom
0.65
0.25
7.10
7.10
0.40
0.10
0.10
0.05
Tolerances of Form and Position
–
–
–
280
Max
0.05
0.70
0.28
7.25
7.25
0.45
090
–
e3
MO-220
3
0.0005
SAM3S Preliminary
0.009
0.274
0.274
0.014
Min
–
–
–
mg
0.008 REF
0.354 bsc
0.354 bsc
0.020 bsc
0.026
0.010
0.280
0.280
0.016
0.004
0.004
0.002
Nom
Inch
–
–
–
0.035
0.001
0.028
0.011
0.285
0.285
0.018
Max
–
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