ATSAM3S4AA-MU Atmel, ATSAM3S4AA-MU Datasheet - Page 797
ATSAM3S4AA-MU
Manufacturer Part Number
ATSAM3S4AA-MU
Description
IC MCU 32BIT 256KB FLASH 48QFN
Manufacturer
Atmel
Series
SAM3Sr
Specifications of ATSAM3S4AA-MU
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 8x10/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S4AA-MU
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
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35.4
Figure 35-2. Application Block Diagram
35.5
Table 35-1.
Notes:
6500C–ATARM–8-Feb-11
Pin Name
MCCDA
MCCK
MCDA0 - MCDA3
Application Block Diagram
Pin Name List
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
(2)
MCDAy to HSMCIx_DAy.
I/O Lines Description for 4-bit Configuration
Pin Description
Command/response
Clock
Data 0..3 of Slot A
9 1011
1
2 3 4 5 6
ex: File System, Audio, Security, etc.
MMC
1213 8
Application Layer
7
HSMCI Interface
Physical Layer
9
1
2 3 4 5 6
Type
I/O/PP/OD
I/O
I/O/PP
SDCard
(1)
7 8
Comments
CMD of an MMC or SDCard/SDIO
CLK of an MMC or SD Card/SDIO
DAT[0..3] of an MMC
DAT[0..3] of an SD Card/SDIO
SAM3S Preliminary
797
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