HD6417727BP100BV Renesas Electronics America, HD6417727BP100BV Datasheet - Page 500

IC SUPERH MPU ROMLESS 240BGA

HD6417727BP100BV

Manufacturer Part Number
HD6417727BP100BV
Description
IC SUPERH MPU ROMLESS 240BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417727BP100BV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
100MHz
Connectivity
FIFO, SCI, SIO, SmartCard, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
104
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 2.05 V
Data Converters
A/D 6x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
240-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Section 14 Direct Memory Access Controller (DMAC)
14. Do not use the DMAC when in sleep mode. Alternately, set the clock ratio to Iφ:Bφ = 1:1
15. Do not use the DMAC when only the IFC[2:0] bits in the frequency control register (FRQCR)
Rev.6.00 Mar. 27, 2009 Page 442 of 1036
REJ09B0254-0600
Measures to avoid the problem:
when using sleep mode. Normal operation cannot be guaranteed otherwise.
are modified and the clock ratio is set to other than Iφ:Bφ = 1:1. Normal operation cannot be
guaranteed otherwise. However, there is no problem if the STC[2:0] bits are modified
simultaneously with the IFC[2:0] bits in the frequency control register (FRQCR).
The problem described above occurs only when all of the above conditions are met. It does
not arise if even one of the conditions is not met. One of the methods listed below should
therefore be employed when using the DMAC to transfer data from XY memory:
(1) Use the direct address mode
(2) Use long word size or word size data
(3) Use big-endian data transfer

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