UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 59

• Manufacturer Part Number: UPD70F3747GB-GAH-AX
• Description: MCU 32BIT V850ES/HX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Hx3r

Specifications of UPD70F3747GB-GAH-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

2.2
ROM and RAM, and I/O.
AD0 to AD15
CS0 to CS3
WAIT
CLKOUT
WR0, WR1
RD
ASTB
HLDAK
HLDRQ
The V850ES/HJ3 has an external bus interface function that enables connection of external memories, such as
Table 2-5 shows the operating status of each external bus interface pin in each operation mode.
Notes 1. The bus control pins function alternately as port pins and are initialized to the input mode (port mode).
Remark Hi-Z: High impedance
Bus Control Pin
Pin Status
2. Pin status in the idle state that is inserted after the T3 state.
Held: The state during the immediately preceding external bus cycle is held.
L:
H:
−:
Low-level output
High-level output
Input without sampling (not acknowledged)
Table 2-5. Pin Operating Status in Each Operation Mode
Hi-Z
Reset
Note 1
HALT Mode and
CHAPTER 2 PIN FUNCTIONS
DMA Transfer
User’s Manual U18854EJ2V0UD
Operating
IDLE1, IDLE2, and
STOP Modes
Hi-Z
H
H
−
L
−
Idle State
Operating
Held
H
−
−
Note 2
Operating
Operating
Bus Hold
Hi-Z
Hi-Z
−
L
57