UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 937

• Manufacturer Part Number: UPD70F3747GB-GAH-AX
• Description: MCU 32BIT V850ES/HX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Hx3r

Specifications of UPD70F3747GB-GAH-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 26-8. Wiring Example of V850ES/HG3 Flash Writing Adapter (FA-100GC-UEU-B)
100
76
Note 1
1
2
5
70
Connect to GND
Connect to VDD
69
8
CHAPTER 26 FLASH MEMORY
(In CSIB0 + HS Mode) (1/2)
9
User’s Manual U18854EJ2V0UD
10
11
V850ES/HG3
4.7 F (recommended value)
12
μ
SI
13
14
SO
61
Note 3
RFU-3
SCK
RUF-2
X1
RFU-1
X2
/RESET
VDE
22
FLMD1 FLMD0
23
V
PP
Note 2
24
RESERVE/HS
25
34
33
26
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