UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 6

• Manufacturer Part Number: UPD70F3747GB-GAH-AX
• Description: MCU 32BIT V850ES/HX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Hx3r

Specifications of UPD70F3747GB-GAH-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

IECUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany.
MINICUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany or a
trademark in the United States of America.
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in
the United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
TRON is an abbreviation of The Real-Time Operating system Nucleus.
ITRON is an abbreviation of Industrial TRON.
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User’s Manual U18854EJ2V0UD