UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 962

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UPD70F3747GB-GAH-AX

Manufacturer Part Number
UPD70F3747GB-GAH-AX
Description
MCU 32BIT V850ES/HX3 64-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Hx3r
Datasheet

Specifications of UPD70F3747GB-GAH-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3.7 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3747GB-GAH-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
28.2 Debugging Without Using DCU
(RXDD0 and TXDD0) or pins for CSIB0 (SIB0, SOB0, SCKB0, and HS (PCM0)) as debug interfaces, without using
the DCU.
28.2.1 Circuit connection examples
960
The following describes how to implement an on-chip debug function using MINICUBE2 with pins for UARTD0
Notes 1. Connect TXDD0/SOB0 (transmit side) of the V850ES/Hx3 to RXD/SI (receive side) of the target
Remark See Table 28-3 for pins used when UARTD0 or CSIB0 is used for communication interface.
Figure 28-3. Circuit Connection Example When UARTD0/CSIB0 Is Used for Communication Interface
2. The V850ES/Hx3-side pin connected to this pin (FLMD0, FLMD1) can be used as an alternate-
3. This connection is designed assuming that the RESET signal is output from the N-ch open-drain
4. The circuit enclosed by broken lines is designed for flash self programming, which controls the
connector, and TXD/SO (transmit side) of the target connector to RXDD0/SIB0 (receive side) of the
V850ES/Hx3.
function pin other than while the memory is rewritten during a break in debugging, because this pin is
in Hi-Z state.
buffer (output resistance: 100 Ω or less).
FLMD0 pin via ports.
programming is not performed, a pull-down resistance for the FLMD0 pin can be within 1 to 10 kΩ.
RESET_IN
RESET_OUT
QB-MINI2
TXD/SO
RXD/SI
FLMD1
FLMD0
GND
VDD
SCK
CLK
Note 1
Note 1
Note 2
Note 2
Note 3
HS
CHAPTER 28 ON-CHIP DEBUG FUNCTION
V
DD
Use the port for inputting or outputting the high level.
User’s Manual U18854EJ2V0UD
10 kΩ
1 to 10 kΩ
1 to 10 kΩ
1 to 10 kΩ
V
V
DD
DD
1 kΩ
V
DD
3 to 10 kΩ
1 to 10 kΩ
10 kΩ
RESET signal
V
DD
100 Ω
V
V
RESET
TXDD0/SOB0
RXDD0/SIB0
SCKB0
HS (PCM0)
FLMD1
FLMD0
Port X
DD
SS
Reset circuit
V850ES/Hx3
When flash self
Note 4

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