UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 743

• Manufacturer Part Number: UPD70F3747GB-GAH-AX
• Description: MCU 32BIT V850ES/HX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Hx3r

Specifications of UPD70F3747GB-GAH-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

16.6.3 Transfer direction specification
transfer direction specification bit has a value of 0, it indicates that the master device is transmitting data to a slave
device. When the transfer direction specification bit has a value of 1, it indicates that the master device is receiving
data from a slave device.
In addition to the 7-bit address data, the master device sends 1 bit that specifies the transfer direction. When this
Note The interrupt request signal (INTIIC0) is generated if a local address or extension code is received during
slave device operation.
INTIIC0
SDA00
SCL00
Figure 16-8. Transfer Direction Specification
AD6
1
AD5
2
User’s Manual U18854EJ2V0UD
CHAPTER 16 I
AD4
3
AD3
4
AD2
2
C BUS
5
AD1
Transfer direction specification
6
AD0
7
R/W
8
9
Note
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