AFS250-FGG256 Actel, AFS250-FGG256 Datasheet - Page 164

• Manufacturer Part Number: AFS250-FGG256
• Description: FPGA - Field Programmable Gate Array 250K System Gates
• Manufacturer: Actel

Specifications of AFS250-FGG256

• Processor Series: AFS250
• Core: IP Core
• Maximum Operating Frequency: 1098.9 MHz
• Number Of Programmable I/os: 114
• Data Ram Size: 36864
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: AFS-Eval-Kit, AFS-BRD600, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 250 K
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device Architecture
2- 14 8
Solution 3
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in
This scheme will also work for a 3.3 V PCI/PCIX configuration, but the internal diode should not be used
for clamping, and the voltage must be limited by the bus switch, as shown in
diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
Figure 2-103 • Solution 3
Solution 4
Figure 2-104 • Solution 4
Table 3-4 on page
5.5 V
5.5 V
5.5 V
3-4. This is a long-term reliability requirement.
Bus
Switch
IDTQS32X23
Off-Chip
Rext1
Available for LVCMOS 2.5 V / 5.0 V.
Off-Chip
Requires one board resistor.
Requires a bus switch on the board,
LVTTL/LVCMOS 3.3 V I/Os.
R e visio n 1
Solution 4
Solution 3
On-Chip
On-Chip
Fusion I/O Input
Fusion I/O Input
2.5 V On-Chip
Clamp
Diode
3.3 V
2.5 V
Figure
2-103. Relying on the