AFS250-FGG256 Actel, AFS250-FGG256 Datasheet - Page 3

FPGA - Field Programmable Gate Array 250K System Gates

AFS250-FGG256

Manufacturer Part Number
AFS250-FGG256
Description
FPGA - Field Programmable Gate Array 250K System Gates
Manufacturer
Actel
Datasheet

Specifications of AFS250-FGG256

Processor Series
AFS250
Core
IP Core
Maximum Operating Frequency
1098.9 MHz
Number Of Programmable I/os
114
Data Ram Size
36864
Supply Voltage (max)
1.575 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
AFS-Eval-Kit, AFS-BRD600, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
250 K
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AFS250-FGG256
Manufacturer:
Actel
Quantity:
135
Part Number:
AFS250-FGG256
Manufacturer:
ACTEL
Quantity:
6 800
Part Number:
AFS250-FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AFS250-FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Product Ordering Codes
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion Device Status
Fusion
AFS090
AFS250
AFS600
AFS1500
M1AFS600
Part Number
Fusion Devices
_
M1AFS1500 =
P1AFS1500 =
M1AFS250 =
M1AFS600 =
ARM-Enabled Fusion Devices
Pigeon Point Devices
P1AFS600 =
MicroBlade Devices
U1AFS600 =
Production
Production
Production
Production
AFS1500 =
Status
AFS090 =
AFS250 =
AFS600 =
1
Speed Grade
Blank = Standard
90,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
600,000 System Gates
1,500,000 System Gates
600,000 System Gates
FG
1 = 15% Faster than Standard
2 = 25% Faster than Standard
M1AFS1500
M1AFS250
M1AFS600
Cortex-M1
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
G
Lead-Free Packaging Options
Production
Production
Production
Status
Blank = Standard Packaging
256
R e visi on 1
G = RoHS-Compliant (green) Packaging
Package Lead Count
Pigeon Point
P1AFS1500
P1AFS600
I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
I = Industrial (–40 to +100°C)
Production
Production
1
Status
Actel Fusion Family of Mixed Signal FPGAs
2
MicroBlade
U1AFS600
Production
Status
III

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